Adhesion in Microelectronics [Hardcover]

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces / interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion? (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings

Preface?xiii

Acknowledgements?xvi

Part 1: Adhesion: Fundamentals and Measurement

1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to? Microelectronics?3
Robert R. Mallik

1.1 Introduction?3

1.2 Principles of IETS?6

1.3 Application of IETS in Microelectronics?13

1.4 Prospects?24

1.5 Summary?26

References?27

2 Adhesion Measuremenl“Ý