Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications [Hardcover]

Since the first edition was published in 2008, Atomic Layer Deposition (ALD) has emerged as a powerful, and sometimes preferred, deposition technology. The new edition of this groundbreaking monograph is the first text to review the subject of ALD comprehensively from a practical perspective. It covers ALD's application to microelectronics (MEMS) and nanotechnology; many important new and emerging applications; thermal processes for ALD growth of nanometer thick films of semiconductors, oxides, metals and nitrides; and the formation of organic and hybrid materials.

Acknowledgements ix

Foreword xi

Preface xiii

1 Fundamentals of Atomic Layer Deposition 1

1.1 Chemical Vapour Deposition 1

1.1.1 Thermal CVD 2

1.1.2 Plasma Enhanced CVD (PECVD) 5

1.2 Vapour Adsorption 6

1.3 Atomic Layer Deposition (ALD) 10

References 29

2 Elemental Semiconductor Epitaxial Films 33

2.1 Epitaxial Silicon 33

References 49

3 III-V Semiconductor Films 51

3.1 Gallium Arsenide 51

3.2 Other III-V Semiconductor Films 63

3.3 Applications 64

References 65

4 Oxide films 67

4.1 Introduction 67

4.2 Aluminum Oxide 68

4.3 Titanium Dioxide 81

4.4 Zinc Oxide 96

4.5 Zirconium Dioxide 101

4.6 Hafnium Dioxide 107

4.7 Other Oxides 112

4.8 Mixed Oxides and Nanolaminates 124

4.9 Multilayers 150

References 151

5 Nitrides and Other Compounds 161

5.1 Introl“