Signal Integrity: From High-Speed to Radiofrequency Applications [Hardcover]

This book presents the necessary concepts for the design and testing of radiofrequency and high-speed circuits. Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students. The subjects covered include: interconnections and signal integrity; spectral analysis techniques for high-speed signals; design techniques for signal integrity; the transmission-line concept; methods for temporal analysis and techniques for frequency domain analysis for connectics.

INTRODUCTION ix

CHAPTER 1. DEGRADATION OF RISE TIME IN INTERCONNECTS 1

1.1. Propagation issues in interconnects 1

1.1.1. Evolution of digital circuits 1

1.1.2. Evolution of signals in interconnects 2

1.1.3. Propagation time on networks 4

1.1.4. Propagation delay in integrated circuits 5

1.1.5. Spectral analysis of signals 6

1.2. Behavior of components at high frequencies 7

1.2.1. Contact wire behavior 7

1.2.2. Resistance behavior at radiofrequencies (RF) 8

1.2.3. RF inductance behavior 8

1.2.4. Capacitance behavior at RF 9

1.2.5. Effects of losses due to conductors: skin effect 11

1.3. Effect on transmission of signals on interconnects 13

1.3.1. Filtering by transmission channel 13

1.3.2. Degradation of rise time in a limited-bandwidth channel 14

1.3.3. Example of a first-order low-pass RC filter 15

1.3.4. Effects of resistive losses from skin effect 16

1.3.5. Rise time in cascading circuits 17