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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits [Hardcover]
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- Category: Books
(Technology & Engineering)
- Author:
Verghese, Nishath K., Schmerbeck, Timothy J., Allstot, David J.
-
Author:
Verghese, Nishath K., Schmerbeck, Timothy J., Allstot, David J.
- ISBN-10:
0792395441
-
ISBN-10:
0792395441
- ISBN-13:
9780792395447
-
ISBN-13:
9780792395447
- Publisher:
Springer
-
Publisher:
Springer
- Binding:
Hardcover
-
Binding:
Hardcover
- Pub Date:
01-Feb-1994
-
Pub Date:
01-Feb-1994
- SKU:
0792395441-11-SPRI
-
SKU:
0792395441-11-SPRI
- Pages:
280
-
Pages:
280
- Item ID: 105296481
- List Price: $169.99
- Seller: ShopSpell
- Ships in: 5 business days
- Transit time: Up to 5 business days
- Delivery by: Oct 13 to Oct 15
- Notes: Brand New Item. Not shipped to AK, HI, APO, FPO, AE.
1 Introduction.- 2 Sources of Noise and Methods of Coupling.- 2.1 Semiconductor Device Noise and Phenomena.- 2.2 Noise from Switching Voltage and Current.- 2.3 Inductive Coupling.- 2.4 Capacitive Coupling.- 2.5 Substrate Coupling.- 2.6 Summary.- 3 Semiconductor Device Simulation.- 3.1 Significance.- 3.2 Basic Equations.- 3.3 Boundary Conditions.- 3.4 Models of Physical Parameters.- 3.5 Spatial Discretization.- 3.6 Solution Methods.- 3.7 A Representative Example.- 3.8 Summary.- 4 Simplified Substrate Modeling and Rapid Simulation.- 4.1 Simplified Equation.- 4.2 Spatial Discretization.- 4.3 Boundary Conditions.- 4.4 Solution Methods.- 4.5 Asymptotic Waveform Evaluation (AWE).- 4.6 Substrate AWE Macromodels.- 4.7 Transient Simulation of AWE Macromodels.- 4.8 Substrate DC Macromodels.- 4.9 Matrix Solution.- 4.10 Results.- 4.11 Summary.- 5 Mesh Generation.- 5.1 Adaptive Mesh Refinement.- 5.2 A Priori Mesh Refinement.- 5.3 Summary.- 6 Substrate Modeling in Heavily-Doped Bulk Processes.- 6.1 Motivation.- 6.2 Single Node Substrate Model.- 6.3 Modified Single Node Substrate Model.- 6.4 Summary.- 7 Substrate Resistance Extraction for Large Circuits.- 7.1 Nested Macromodeling.- 7.2 Interpolated Macromodeling.- 7.3 Summary.- 8 Modeling Chip/Package Power Distribution.- 8.1 Effect of Power Bus Structure on Noise coupling.- 8.2 Summary.- 9 Controlling Substrate Coupling in Heavily-Doped Bulk Processes.- 9.1 Characterization of noise coupling concepts.- 9.2 P+ Bulk Wafer Characterization.- 9.3 Effect of Substrate contact placement on coupled noise.- 9.4 Effect of Package Inductance on Substrate noise.- 9.5 Noise Coupling Control Techniques.- 9.6 Summary.- 10 Controlling Substrate Coupling in Bulk P- Wafers.- 10.1 Bulk P- Wafer Characteristics.- 10.2 Substrate Attenuation Structures.-10.3 Summary.- 11 Chip/Package Shielding and Good Circuit Design Practice.- 11.1 Far Field Radiated Emissions.- 11.2 Effect of Chip Signal Isolation/Shielding Techniques on Noise.- 11.3 Effect of PackalS9