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Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits [Hardcover]

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  • Category: Books (Technology & Engineering)
  • Author:  Verghese, Nishath K., Schmerbeck, Timothy J., Allstot, David J.
  • Author:  Verghese, Nishath K., Schmerbeck, Timothy J., Allstot, David J.
  • ISBN-10:  0792395441
  • ISBN-10:  0792395441
  • ISBN-13:  9780792395447
  • ISBN-13:  9780792395447
  • Publisher:  Springer
  • Publisher:  Springer
  • Binding:  Hardcover
  • Binding:  Hardcover
  • Pub Date:  01-Feb-1994
  • Pub Date:  01-Feb-1994
  • SKU:  0792395441-11-SPRI
  • SKU:  0792395441-11-SPRI
  • Pages:  280
  • Pages:  280
  • Item ID: 105296481
  • List Price: $169.99
  • Seller: ShopSpell
  • Ships in: 5 business days
  • Transit time: Up to 5 business days
  • Delivery by: Oct 13 to Oct 15
  • Notes: Brand New Item. Not shipped to AK, HI, APO, FPO, AE.
1 Introduction.- 2 Sources of Noise and Methods of Coupling.- 2.1 Semiconductor Device Noise and Phenomena.- 2.2 Noise from Switching Voltage and Current.- 2.3 Inductive Coupling.- 2.4 Capacitive Coupling.- 2.5 Substrate Coupling.- 2.6 Summary.- 3 Semiconductor Device Simulation.- 3.1 Significance.- 3.2 Basic Equations.- 3.3 Boundary Conditions.- 3.4 Models of Physical Parameters.- 3.5 Spatial Discretization.- 3.6 Solution Methods.- 3.7 A Representative Example.- 3.8 Summary.- 4 Simplified Substrate Modeling and Rapid Simulation.- 4.1 Simplified Equation.- 4.2 Spatial Discretization.- 4.3 Boundary Conditions.- 4.4 Solution Methods.- 4.5 Asymptotic Waveform Evaluation (AWE).- 4.6 Substrate AWE Macromodels.- 4.7 Transient Simulation of AWE Macromodels.- 4.8 Substrate DC Macromodels.- 4.9 Matrix Solution.- 4.10 Results.- 4.11 Summary.- 5 Mesh Generation.- 5.1 Adaptive Mesh Refinement.- 5.2 A Priori Mesh Refinement.- 5.3 Summary.- 6 Substrate Modeling in Heavily-Doped Bulk Processes.- 6.1 Motivation.- 6.2 Single Node Substrate Model.- 6.3 Modified Single Node Substrate Model.- 6.4 Summary.- 7 Substrate Resistance Extraction for Large Circuits.- 7.1 Nested Macromodeling.- 7.2 Interpolated Macromodeling.- 7.3 Summary.- 8 Modeling Chip/Package Power Distribution.- 8.1 Effect of Power Bus Structure on Noise coupling.- 8.2 Summary.- 9 Controlling Substrate Coupling in Heavily-Doped Bulk Processes.- 9.1 Characterization of noise coupling concepts.- 9.2 P+ Bulk Wafer Characterization.- 9.3 Effect of Substrate contact placement on coupled noise.- 9.4 Effect of Package Inductance on Substrate noise.- 9.5 Noise Coupling Control Techniques.- 9.6 Summary.- 10 Controlling Substrate Coupling in Bulk P- Wafers.- 10.1 Bulk P- Wafer Characteristics.- 10.2 Substrate Attenuation Structures.-10.3 Summary.- 11 Chip/Package Shielding and Good Circuit Design Practice.- 11.1 Far Field Radiated Emissions.- 11.2 Effect of Chip Signal Isolation/Shielding Techniques on Noise.- 11.3 Effect of PackalS9
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