Solder Joint Technology: Materials, Properties, and Reliability [Hardcover]

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1^st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

CopperTin Reactions.- CopperTin Reactions in Bulk Samples.- CopperTin Reactions in Thin-Film Samples.- CopperTin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of CopperTin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductileto-Brittle Transition of Solder Joints Affected by CopperTin Reaction and Electromigration.- Thermomigration.Addresses the urgent need for reliable, lead-free solders in electronic manufacturing Reviews the basic science of copper-tin reactions and electromigration Emphasizes reliability issues related to solder joint reactions and electromigration induced failure in electronic consumer products and computers Discusses the need for and suggests improvements in solder joint reliability and the science of solder joint behavior

Solder joints are ublCp