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THz and Sub-THz CMOS Electronics for High-Speed Telecommunication: Architectures and Circuits for Future 6G Transceivers [Hardcover]

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  • Category: Books (Technology & Engineering)
  • Author:  Dheer, Carl, Reynaert, Patrick
  • Author:  Dheer, Carl, Reynaert, Patrick
  • ISBN-10:  3031644387
  • ISBN-10:  3031644387
  • ISBN-13:  9783031644382
  • ISBN-13:  9783031644382
  • Publisher:  Springer
  • Publisher:  Springer
  • Binding:  Hardcover
  • Binding:  Hardcover
  • SKU:  3031644387-11-SPRI
  • SKU:  3031644387-11-SPRI
  • Pages:  402
  • Pages:  402
  • Item ID: 106803331
  • List Price: $199.99
  • Seller: ShopSpell
  • Ships in: 5 business days
  • Transit time: Up to 5 business days
  • Delivery by: Oct 14 to Oct 16
  • Notes: Brand New Item. Not shipped to AK, HI, APO, FPO, AE.

This book provides a complete overview of high-speed circuit design for high-speed telecommunication above 100GHz. Covering everything from telecom and electronics fundamentals to system-level modeling, detailed circuit design, and in-depth performance analysis, this book lends itself as the perfect design guide and reference work for beginner and experienced telecommunication circuit designers alike.

Chapter 1. Introduction.- Chapter 2. Fundamentals of Telecommunication.- Chapter 3. Basic Electronics and Components.- Chapter 4. High-Frequency Circuit Design.- Chapter 5. System-Level Considerations.- Chapter 6. A High-Speed 390GHz BPOOK Transmitter.- Chapter 7. A 135GHz Direct-Digital 16-QAM Wireless and DWG Link.- Chapter 8. Conclusion.

Carl Dheer was born in Deurne, Belgium, in 1995. He received the B.Sc. degree in electrical and mechanical engineering (magna cum laude) and the M.Sc. degree in electrical engineering (microelectronics) (summa cum laude) from KU Leuven in 2016 and 2018, respectively. His masters thesis revolved around the design of a CMOS integrated optical radio receiver and earned him facultys best masters thesis award. As part of his M.Sc program in electrical engineering, he attended one semester at Columbia University supported by the Melexis - Columbia scholarship. In 2018, he joined the MICAS Research Group, KU Leuven, Belgium, where he is currently pursuing the Ph.D. degree. In 2024, he joined Huawei Technologies Research and Development Belgium as a senior RFIC Design Engineer. His research interests include millimeter-wave/THz CMOS circuits and transceiver architectures for high-speed communication systems. He also serves as a reviewer for the IEEE Journal of Solid-State Circuits and the IEEE Solid-State Circuits Letters. He was the recipient of the Platinum (1st place) Award at the Huawei PhD Student Contest IC Design Benelux Edition in 2022.

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