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Ultraclean Surface Processing of Silicon Wafers: Secrets of VLSI Manufacturing [Paperback]

$219.99     $329.99   33% Off      (Free Shipping)
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  • Category: Books (Technology & Engineering)
  • ISBN-10:  3642082726
  • ISBN-10:  3642082726
  • ISBN-13:  9783642082726
  • ISBN-13:  9783642082726
  • Publisher:  Springer
  • Publisher:  Springer
  • Pages:  616
  • Pages:  616
  • Binding:  Paperback
  • Binding:  Paperback
  • Pub Date:  01-Mar-2010
  • Pub Date:  01-Mar-2010
  • SKU:  3642082726-11-SPRI
  • SKU:  3642082726-11-SPRI
  • Item ID: 100933670
  • List Price: $329.99
  • Seller: ShopSpell
  • Ships in: 5 business days
  • Transit time: Up to 5 business days
  • Delivery by: Oct 13 to Oct 15
  • Notes: Brand New Item. Not shipped to AK, HI, APO, FPO, AE.
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.I. Introduction.- 1. Ultraclean Technology for VLSI Manufacturing: An Overview.- II. Influence of Contamination on Silicon Device Characteristics.- 2. Influence of Silicon Crystal Quality on Device Characteristics.- 3. Influence of Contaminants on Device Characteristics.- 4. Influence of Metallic Contamination on Dielectric Degradation of MOS Structures.- 5. Influence of Micro-Roughness on Device Characteristics.- III. Mechanisms of Particle Adhesion on Wafer Surfaces.- 6. Particle Deposition in Air.- 7. Particle Deposition in Plasma.- 8. Particle Deposition in Vacuum.- 9. Particle Adhesion in Liquids.- 10. Particle Adhesion and Removal on Wafer Surfaces in RCA Cleaning.- 11. Effects of Electrostatic Charge on Particle Adhesion on Wafer Surfaces.- IV. Analysis and Evaluation of Silicon Wafer Surfaces: Fundamentals.- 12. Measurement of Particles on Wafer Surfaces.- 13. Analysis and Evaluation of Impurities on Wafer Surfaces.- 14. Analysis and Evaluation of Molecules Adhered to Wafer Surfaces.- 15. Electrical Evaluation of Metallic Impurities on Wafer Surfaces.- 16. Analysis of Microscopic Areas on Wafer Surfaces Using STM/AFM.- V. Analysis and Evaluation of Wafer Surfaces: Applications to Semiconductor Manufacturing Lineló
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