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3D Integration for NoC-based SoC Architectures [Paperback]

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  • Category: Books (Technology & Engineering)
  • ISBN-10:  1461427487
  • ISBN-10:  1461427487
  • ISBN-13:  9781461427483
  • ISBN-13:  9781461427483
  • Publisher:  Springer
  • Publisher:  Springer
  • Pages:  278
  • Pages:  278
  • Binding:  Paperback
  • Binding:  Paperback
  • Pub Date:  01-Feb-2012
  • Pub Date:  01-Feb-2012
  • SKU:  1461427487-11-SPRI
  • SKU:  1461427487-11-SPRI
  • Item ID: 100703499
  • List Price: $119.99
  • Seller: ShopSpell
  • Ships in: 5 business days
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  • Delivery by: Jul 04 to Jul 06
  • Notes: Brand New Book. Order Now.
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures.Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.Back Cover CopySERIES:Integrated Circuits and Systems3D-Integration for NoC-based SoC Architecturesby:(Editors)Abbas SheibanyradFr?d?ric PetrotAxel JanstchThis book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architecturesl³ƒ
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