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Advanced Wirebond Interconnection Technology [Mixed media product]

$227.99     $329.99    31% Off      (Free Shipping)
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  • Category: Books (Technology & Engineering)
  • Author:  Prasad, Shankara K.
  • Author:  Prasad, Shankara K.
  • ISBN-10:  1402077629
  • ISBN-10:  1402077629
  • ISBN-13:  9781402077623
  • ISBN-13:  9781402077623
  • Publisher:  Springer
  • Publisher:  Springer
  • Binding:  Mixed media product
  • Binding:  Mixed media product
  • Pub Date:  01-Mar-2004
  • Pub Date:  01-Mar-2004
  • Pages:  704
  • Pages:  704
  • SKU:  1402077629-11-SPRI
  • SKU:  1402077629-11-SPRI
  • Item ID: 100710043
  • List Price: $329.99
  • Seller: ShopSpell
  • Ships in: 5 business days
  • Transit time: Up to 5 business days
  • Delivery by: Jul 04 to Jul 06
  • Notes: Brand New Book. Order Now.

From the reviews:

This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and automatic bonders for a product line are included.

The book is very good with visual explanations for quick grasping of the issues. In addition, the fundamental metallurgical or mechanical root causes behind material and process choices are presented.

The book has a clear prose style and a very readable font and page layout. The figures, although effective, are simply low resolution screen prints from a personal computer and thus have aliasing and fuzziness.

This book has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. The majority of the book dwells on establishing the bonding process for a particular product; determining the window of adjustments. The book ends with discussions on establishing quality metrics and reliability assurance tests.

Each chapter of the book includes enough tutorial information to allow it to alone with little need to page backwards. A short but good reference section is at the end.

If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book. ( CMPT Newsletter, June 2005)

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of informlc¥
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