Offers a basic, up-to-date introduction to semiconductor fabrication technology, including both the theoretical and practical aspects of all major steps in the fabrication sequence
Presents comprehensive coverage of process sequences
Introduces readers to modern simulation tools
Addresses the practical aspects of integrated circuit fabrication
Clearly explains basic processing theoryChapter 1. Introduction.
Chapter 2. Crystal Growth.
Chapter 3. Silicon Oxidation.
Chapter 4. Photolithography.
Chapter 5. Etching.
Chapter 6. Diffusion.
Chapter 7. Ion Implantation.
Chapter 8. Film Deposition.
Chapter 9. Process Integration.
Chapter 10. IC Manufacturing.
Chapter 11. Future Trends and Challenges.
Appendix A: List of Symbols.
Appendix B: International System of Units (SI Units).
Appendix C: Unit Prefixes.
Appendix D: Greek Alphabet.
Appendix E: Physical Constants.
Appendix F: Properties of Si and GaAs at 300 K.
Appendix G: Some Properties of the Error Function.
Appendix H: Basic Kinetic Theory of Gases.
Appendix I: SUPREM Commands.
Appendix J: Running PROLITH.
Appendix K. Percentage Points of the t Distribution.
Appendix L: Percentage Points of the F Distribution.
Index.
Gary S. May, Ph.D. is Executive Assistant to the President and Motorola Foundation Professor of Microelectronics in the School of Electrical and Computer Engineering at the Georgia Institute of Technology. Dr. May was a national Science Foundation national Young Investigator, Georgia Tech?s Oulº