This book summarizes a five year research project, as well as subsequent results regarding high power diode laser systems and their application in materials processing. The text explores the entire chain of technology, from the semiconductor technology, through cooling mounting and assembly, beam shaping and system technology, to applications in the processing of such materials as metals and polymers. Includes theoretical models, a range of important parameters and practical tips.
1Motivation and introduction 2High power diode laser technlogy and characteristics 2.1Principles of diode operation 2.2Manufacturing technology 2.3Chip characterization methods and operation 2.4Broad area emitters and arrays 2.5High brightness emitters and arrays 3Packaging of diode laser bars 3.1General aspects 3.2Mounting of diode laser bars 3.3Cooling 3.3.1Introduction 3.3.2 Conduction cooling 3.3.3Micro-channel heatsinks 3.3.4Heatspreaders 3.4Expansion-matched packages 3.5Mounting of micro-optics 4Stacking and incoherent superposition 4.1 Introduction and Survey 4.2 Beam collimation 4.3 Techniques for Beam Combination 4.4 Stacking Techniques 4.5 Beam symmetrization and fiber coupling 4.6 Beam-Quality limits and comparison to coherent coupling 5 Laser systems: beam characteristics, metrology and standards 5.1 Introdiuction 5.2 Theoretical background of beam propagation 5.2.1 Preliminaries 5.2.2 Temporal integration, coherence 5.2.3 Wigner distribution 5.2.4 Propagation of the Wigner distribution through linear optical systems 5.3 Density distribution 5.3.1 Power density distribution in the far field 5.3.2 Width of a power density distribution in a transverse plane 5.4 Propagation of the beam width 5.4.1 Theoretical background 5.4.2 Beam classification 5.4.3 Propagation of the beam width of stigmatic and simple astigmatic beams 5.5. Measurement of the beam power 5.6 Measurement of the power density distribution and the beam propagation ratio, M? 5.6.1 Camera systems 5.6lăl