Electronic Packaging for High Reliability, Low Cost Electronics [Hardcover]

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997Preface. Performance Predictions. Possibilities of Thermal Resonance in Microcircuits; G. De Mey. Signal Integrity Analysis in Cost Sensitive Interconnections; P. Svasta, et al. The Use of Nonlinearity Measurements for the Reliability Assessment; P.J. Mach. Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure; E. Suhir. The Impact of Stress on the Noise, Quality and Reliability of Passive and Active Devices; J. Sikula, P. Vasina. Process and Materials Development. Smart Unit for Technological Monitoring in Electrochemical Industry; R. Ionescu, et al. Lower Patterning of Printed Wiring Boards for MCM-Ls; ZS. Illyefalvi-Vit?z, et al. Silver Filled Adhesives-Controlling Rheology and Electrical Conductivity; P. Sexton, et al. Silicides Formation in Metal-Silicon Film Systems: The Role of Impurities; Yu. Makogon, S.I. Sidorenko. Mechanical properties of Pb-Sn-In-Ag Solders from -100?l³