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Through-Silicon Vias for 3D Integration [Hardcover]

$185.99       (Free Shipping)
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  • Category: Books (Technology & Engineering)
  • Author:  Lau, John H.
  • Author:  Lau, John H.
  • ISBN-10:  0071785140
  • ISBN-10:  0071785140
  • ISBN-13:  9780071785143
  • ISBN-13:  9780071785143
  • Publisher:  McGraw Hill
  • Publisher:  McGraw Hill
  • Binding:  Hardcover
  • Binding:  Hardcover
  • Pub Date:  01-Jun-2012
  • Pub Date:  01-Jun-2012
  • SKU:  0071785140-11-MPOD
  • SKU:  0071785140-11-MPOD
  • Item ID: 105059386
  • Seller: ShopSpell
  • Ships in: 2 business days
  • Transit time: Up to 5 business days
  • Delivery by: Jul 08 to Jul 10
  • Notes: Brand New Book. Order Now.
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