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Signal Propagation on Interconnects [Paperback]

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  • Category: Books (Technology & Engineering)
  • ISBN-10:  1441950591
  • ISBN-10:  1441950591
  • ISBN-13:  9781441950598
  • ISBN-13:  9781441950598
  • Publisher:  Springer
  • Publisher:  Springer
  • Pages:  148
  • Pages:  148
  • Binding:  Paperback
  • Binding:  Paperback
  • Pub Date:  01-Mar-2010
  • Pub Date:  01-Mar-2010
  • SKU:  1441950591-11-SPRI
  • SKU:  1441950591-11-SPRI
  • Item ID: 100883759
  • List Price: $109.99
  • Seller: ShopSpell
  • Ships in: 5 business days
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  • Delivery by: Jul 12 to Jul 14
  • Notes: Brand New Book. Order Now.
Foreword; J.P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W.T. Beyenne, J.E. Schutt-Ain?. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O.A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.Springer Book Archives
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