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Solder Paste in Electronics Packaging Technology and Applications in Surface Mo [Paperback]

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  • Category: Books (Technology & Engineering)
  • Author:  Hwang, Jennie S.
  • Author:  Hwang, Jennie S.
  • ISBN-10:  940116052X
  • ISBN-10:  940116052X
  • ISBN-13:  9789401160520
  • ISBN-13:  9789401160520
  • Publisher:  Springer
  • Publisher:  Springer
  • Binding:  Paperback
  • Binding:  Paperback
  • Pub Date:  01-Mar-2012
  • Pub Date:  01-Mar-2012
  • SKU:  940116052X-11-SPRI
  • SKU:  940116052X-11-SPRI
  • Item ID: 105297749
  • List Price: $54.99
  • Seller: ShopSpell
  • Ships in: 5 business days
  • Transit time: Up to 5 business days
  • Delivery by: Jul 03 to Jul 05
  • Notes: Brand New Book. Order Now.
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