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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Envir [Paperback]

$79.99       (Free Shipping)
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  • Category: Books (Technology &Amp; Engineering)
  • Author:  Cepeda-Rizo, Juan, Gayle, Jeremiah, Ravich, Joshua
  • Author:  Cepeda-Rizo, Juan, Gayle, Jeremiah, Ravich, Joshua
  • ISBN-10:  1032160853
  • ISBN-10:  1032160853
  • ISBN-13:  9781032160856
  • ISBN-13:  9781032160856
  • Publisher:  CRC Press
  • Publisher:  CRC Press
  • Pages:  304
  • Pages:  304
  • Binding:  Paperback
  • Binding:  Paperback
  • SKU:  1032160853-11-MPOD
  • SKU:  1032160853-11-MPOD
  • Item ID: 107114934
  • Seller: ShopSpell
  • Ships in: 2 business days
  • Transit time: Up to 5 business days
  • Delivery by: Apr 02 to Apr 04
  • Notes: Brand New Book. Order Now.
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