1. lntroduction.- 1.1 The Significance of Semiconductor Integrated Circuits.- 1.2 Prospects of High-Density Integration.- 1.3 Device Dimensions and Density of Integration.- 1.4 Outline of the Microfabrication Technology.- 2. Electron Beam Lithography.- 2.1 Background.- 2.1.1 History of the Machine Development.- 2.1.2 Classification of the Machines.- a) Electron-Beam Source.- b) Beam Shape.- c) Beam Scanning.- d) Sample Movement.- e) Samples.- 2.1.3 Factors Determining Pattern Accuracy.- a) Beam Diameter.- b) Aberrations in the Electron-Optics System.- c) Sample Movement, Beam-Position Control and Alignment.- d) Proximity Effect.- 2.1.4 Factors Determining the Drawing Speed.- 2.2 Components for Electron-Beam Lithography.- 2.2.1 Electron-Beam Source.- a) Fundamentals.- b) Lanthanum Hexaboride (LaB6) Cathode Electron Gun.- c) Field-Emission (FE) Electron Gun.- 2.2.2 Electron Optical Column.- a) Electromagnetic Lens.- b) Electrostatic Lens.- c) Demagnifying Electron-Optical Column.- d) Magnifying Electron-Optical Column.- 2.2.3 Electron-Beam Delineation.- a) Delineation of Spatially Separated Figures.- b) Delineation of Figures Over the Surface of a Large Work Piece.- 2.2.4 Alignment.- a) Alignment Mark Structure.- b) Mark Position Deciding Method.- c) Writing Position Compensation Method.- d) Comments.- 2.2.5 Radiation Damage.- 2.3 Software for Electron-Beam Lithography.- 2.3.1 Pattern Data Processing.- a) Input Files.- b) Fundamental Pattern Data Processing Operations.- c) Algorithms.- 2.3.2 Correction of Distortion.- 2.3.3 Correction of the Proximity Effect.- a) Fitting the EID Function.- b) Dosage Calculation and Representative Points.- c) Pattern-Shape Adjustment Techniques.- d) Dot-Beam Correction.- e) Simultaneous Correction Method.- 2.3.4 Warped-Wafer Correction.- a) Algorithm.- b) Cubic Interpolation Method.- 2.4 Wafer and Writing Systems.- 2.4.1 EB System with High Current FE Gun (VL-FI).- a) Electron Gun and the Electron-Optical System.- b) Mechanical System.l